HMC will enable a new generation of performance in applications ranging from large-scale networking and high-performance computing, to industrial automation and, eventually, consumer products.
“This is a milestone in the industry move to 3D semiconductor manufacturing,” said Subu Iyer, IBM Fellow. “The manufacturing process we are rolling out will have applications beyond memory, enabling other industry segments as well. In the next few years, 3D chip technology will make its way into consumer products, and we can expect to see drastic improvements in battery life and functionality of devices.”
“HMC is a game changer, finally giving architects a flexible memory solution that scales bandwidth while addressing power efficiency,” said Robert Feurle, Vice President of DRAM Marketing for Micron. “Through collaboration with IBM, Micron will provide the industry’s most capable memory offering.”